Dry etching principle of zirconium dioxide

Its principle is that the chemically active radicals in plasma react with the etched material, thus achieving the purpose of etching. Because the core of etching is chemical reaction (only independent of the gas state of the solution), the etching effect is somewhat similar to wet etching, with good selectivity but poor anisotropy. Zirconia dry etching has the advantages of high precision, high efficiency and low pollution, and is widely used in microelectronics, optoelectronics, biomedicine and other fields.