What are the English full names of SMT and DIP in the production of electronic components? What exactly does it mean?

SMT (surface mount technology) generally refers to surface mount technology (process), and dual in-line package is also called DIP package or DIP package, or DIP or DIL for short, which is a packaging method of integrated circuits.

Surface mount technology, namely SMT (abbreviation of surface mount technology), is the most popular technology and process in electronic assembly industry at present. Electronic products have high assembly density, small volume and light weight. The size and weight of the patch component are only about110 of the traditional plug-in component. Generally, after SMT, the size of electronic products is reduced by 40%~60% and the weight is reduced by 60%~80%.

The shape of the integrated circuit is rectangular, and there are two rows of parallel metal pins on both sides, which is called pin arrangement. The components of the DIP package can be soldered in the plated through hole of the printed circuit board or inserted into the DIP socket.

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The innovation of packaging technology has also become a powerful driving force for the sustainable development of semiconductor and electronic manufacturing technology, and has a great impact on the improvement of semiconductor front-end technology and surface mount technology. If bump generation of flip chip is an extension of the former semiconductor process to the latter packaging, then bump generation of silicon wafer based on wire bonding is an extension of packaging technology to the former one.

DIP packaging is very popular in the era when memory particles are directly inserted into the motherboard. DIP also has a derivative, SDIP (Shrinking DIP), whose needle density is six times that of DIP.

Baidu Encyclopedia-Surface Mount Technology

Baidu encyclopedia -DIP