What is the detailed process of FPC production?

FPC production process (whole process) \x0d\ 1. FPC manufacturing process: 1. 1 double panel process: \x0d\ Cutting → Drilling → PTH → Electroplating → Pretreatment → Sticking Dry Film → Alignment → Exposure → Development → Graphic Electroplating → Stripping → Pretreatment → Sticking Dry Film → Alignment Exposure → Development → Etching → Stripping → Surface Treatment → Sticking Film → Pressing → Curing → Nickel-\x0d\ Plating → Printing → Cutting → Electrical Measurement → Punching → Final Inspection →/kloc- 2. 1. Understanding of raw material coding \x0d\ NDIR0505 13HJY: D→ double-sided, R→ rolled copper, 05→PI thickness 0.5mil, that is, 12.5um, 05→ copper thickness/kloc-0. XSIE 10 1020TLC: S→ single side, E→ electrolytic copper, 10→PI thickness 25um, 10→ copper thickness 35um, 20→ glue thickness 20um. \x0d\ CI05 12NL:。 12→ glue thickness 12.5um Total thickness: 25um. 2.2. Process quality control \ x0d \ a. Operators should wear gloves and finger covers to prevent the sweat on their hands from oxidizing the copper foil surface. B. correct stacking method to prevent wrinkling. \ x0d \ C. Irreversible. D. Material quality: the surface of the material shall be free of wrinkles, stains and reoxidation, and the cut material shall be free of burrs and glue overflow. 3. Drilling \x0d\ 3. 1 Packaging: Select cover plate → assemble plate → stick with adhesive tape → arrow (crossed) \ x0d \ 3. 1. Package 15 sheets. 3. 1.2 The main function of the cover plate is: \x0d\ A: to prevent the drilling rig and presser foot from squeezing the material surface. B: Make the drill tip center easy to locate and avoid the deviation of drilling position. X0d \ c: Take away the heat generated by the friction between the drill bit and the hole wall. 3.2 Drilling: \x0d\ 3.2. 1 Process: start → board → transfer to program → set parameters → drilling → self-inspection →IPQA inspection → mass production → transfer to the next process. \x0d\ 3.2.2。 Control method of drilling needle: a. Control of use times B. Identification and inspection method of new drill bit \x0d\ 3.3. Correct. C. confirm whether the holes are completely connected. D the appearance should be free of copper warpage, burr and other undesirable phenomena. 3.4. Common undesirable phenomena \x0d\ 3.4. 1 broken needle: a. Improper operation of drilling rig. The drill bit problem. C. too fast feeding, etc. 3.4.2. Rough edges. A. incorrect cover plate and back plate. B. 4. 1。 Principle and function of PTH: PTH is a process in which copper ions are deposited on the activated hole wall and copper foil surface by autocatalytic redox reaction of plating solution (palladium and copper atoms as catalysts) without external current. Also known as electroless copper plating or autocatalytic copper plating. \x0d\ 4.2.PHT process: alkali degreasing → water washing → etching → water washing → prepreg → activation → water washing → acceleration → water washing → copper melting → water washing. \ x0d \ 4.3。 PTH \x0d\ 4.3. 1 Treatment of common defects. Incorrect bath composition. \x0d\ 4.3.2。 There are particles and roughness on the hole wall: there are particles in a chemical tank, and the copper powder is unevenly deposited. Open the filter to filter. The hole wall of plate B itself has burrs. \x0d\ 4.3.3。 The surface of cardboard is black: the composition of chemical bath is incorrect (NaOH concentration is too high). \x0d\ 4.4 Copper plating is copper plating. Ensure that the coating thickness of the whole layout (the whole coating in the hole and near the orifice) meets certain requirements. 4.4. 1 electroplating condition control a current density selection b electroplating area size c coating thickness requirement d electroplating time control 4.4. 1 quality control \x0d\ 1 connectivity: self-check QC for full inspection, and check whether there is copper plating penetration on the hole wall with a 40x magnifying glass. 2. Surface quality: The surface of copper foil should be free of scorching, peeling, graininess, pinholes and bad spots. 3. Sticking: After being stuck anywhere on the edge of the board with 3M tape, it should be connected vertically upwards. 5. Wiring \x0d\ 5. 1 dry film is attached to the board, and the circuit is basically formed after exposure and development. In this process, the dry film mainly plays the role of image transfer and protects the circuit during etching. \x0d\ 5.2 Dry film is mainly composed of PE, photoresist and PET, of which PE and PET only play the role of protection and isolation. Photoresist includes: linker and initiator. Adhesion promoter, pigment. \x0d\ 5.3 The operation requires that A keep the dry film and board surface clean, B keep flat, free of bubbles and wrinkles .. C meet the requirements of adhesion and have high adhesion. \x0d\ 5.4 Key points of operation quality control \x0d\ 5.4. 1 In order to prevent wire breakage during pasting, first clean the impurities on the surface of copper foil with a dust-free paper roller. 5.4.2 Parameters such as temperature, pressure and revolution of heating roller should be set according to different plates. 5.4.3 Ensure that the directions of copper foil holes are consistent. 5.4.4 Prevent oxidation and direct contact with the surface of copper foil. \x0d\ 5.4.5 There should be no scars on the heating roller to prevent wrinkling and adhesion. X0d\ 5.4.6 Let it stand for 10-20 minutes after pasting, and then expose it. The time is too short, the organic polymerization reaction is incomplete, and the time is too long to hydrolyze easily, resulting in poor coating. 5.4.7 Always wipe off impurities and spills on the heating roller with dust-free paper. 5.4.8 Ensure that the film has good adhesion. X0d\ 5.5. 1 Adhesion: The circuit cannot be bent, deformed or broken after pasting (detected by a magnifying glass). 5.5.2 Smoothness: It must be smooth and free from wrinkles and bubbles. 5.5.3 Cleanliness: Impurities on each piece of paper shall not exceed 5 points. 5.6 Exposure \x0d\ 5.6. 1. Principle: The lines are transferred to the board through the action of dry film. 5.6.2 Key points of operation: a Keep the negative film and negative plate clean during operation. \x0d\ b The negative and cardboard should be aligned correctly. There should be no bubbles and impurities. \x0d\ * The purpose of vacuumizing is to improve the contact tightness between negative film and dry film and reduce astigmatism. * Exposure energy also affects the quality: \x0d\ 1, low energy, insufficient exposure, too soft resist after imaging, dark color, damaged or floating resist during etching, resulting in circuit break. \x0d\ 2。 High energy can lead to overexposure. Then the lines will shrink or the exposed areas will be washed away easily. 5.7 Development \x0d\ 5.7. 1 Principle: Development refers to treating the exposed plate with (1.0+/-0. 1)% sodium carbonate solution (developer), and washing off the unexposed dry film and keeping it. Make the circuit basically take shape. 5.7.2 Factors affecting the quality of imaging operation: A, developer component B, developing temperature C, developing pressure D, developer distribution uniformity E, and machine speed. \x0d\ 5.7.3 Process parameter control: solution solubility, developing temperature, developing speed and spraying pressure. A, there can be no water droplets on the wrench, and it should be blown clean. B, dry film protection film can't be torn off. \x0d\ c, the development should be complete, and the lines should not be serrated, bent or thinned. \ x0d \ d, the bare copper surface after development should be scraped lightly with a knife, so that the dry film will not fall off, otherwise the quality will be affected at all times. E, dry film linewidth and negative film linewidth should be controlled at+/. F, the complex side of the circuit should be placed downward to avoid film residue and reduce uneven development caused by pool effect. \ x0d \ g, developer should be updated in time according to the solubility, origin and use time of sodium carbonate to ensure the best development effect. \ x0d \ h, it is necessary to regularly clean the scale in the tank and in the spray head and nozzle to prevent impurities from polluting the plate and causing uneven distribution of developer during operation. A, card board, should stop rotating device, immediately put off the board, take out the board to the middle of the developing table. If it is not fully developed, it should be redeveloped. \x0d\ j, the plates after development and blow-drying should be separated by green film to prevent the dry film from sticking and affecting the quality at all times. 5.8 Etching Stripping \ x0d \ 5.8. 1 Principle: Etching is to spray etching solution evenly on the surface of copper foil through a nozzle at a certain temperature (45-50℃) and react with copper without the protection of etching inhibitor, but unnecessary copper reacts to expose the substrate, and then a circuit is formed through peeling treatment. \x0d\ 5.8.2 Main components of etching solution: acidic etchant. Key points of soft water 5.9 etching quality control: \x0d\ 5.9. 1 No residual copper, wrinkles, scratches, etc. 5.9.2 The pipeline shall be free from deformation and water drops. \x0d\ 5.9.3 The speed should be appropriate at all times, and line thinning and endless etching caused by excessive etching are not allowed. 5.9.6 When placing plates, pay attention to avoid board jamming and prevent oxidation. \x0d\ 5.9.7 The liquid medicine should always be evenly distributed, so as to avoid uneven etching on the front and back or different parts on the same side. 5.9.8 Process control parameters: \x0d\ etching solution temperature: 45 5℃; Temperature of stripping solution: 55 5℃; Etching temperature: 45-50℃; Drying temperature: 75 5℃; Spacing between front and rear plates: 5 ~ 10 cm 6 \ x0d \ As a pretreatment or post-treatment process of other processes, generally, the plate is first treated with acid pickling and oxidation resistance, and then the surface of the plate is polished with a grinding brush to remove impurities, blackening layer and residual glue. \x0d\ 6. 1. 1 process flow: feeding-acid washing-water washing-brush grinding-pressurized water washing-suction drying-drying-discharging 6. 1.2 grinding type: \ x0d \ a to be pasted and packaged: grinding, removing erythema (. No oxidation or water drop residue. C. there is no wrinkling and squeezing caused by the roller. 6. 1.4 Common defects and their prevention: \x0d\ a has water droplets on its surface. At this time, check whether the sponge roller is too wet, clean it regularly and extrude it. B thoroughly remove the oxidized water and check whether the pressure of the brush roller is sufficient. Is the transfer too fast? C. the blackening layer is not cleaned. 6.2 Bonding: \x0d\ 6.2. 1 Operating procedure: \x0d\ a Prepare tools, determine the number of semi-finished products to be bonded, and prepare correct packaging. \x0d\ b Copper foil must not be oxidized. Check the clean copper foil: the surface has been lightly brushed with a brush to remove fluff or impurity C, and then the package is torn off. X0d\ d Align the package correctly according to the circulation card and MI data and fix it with an electric iron. Semi-finished products after e-bonding should be sent to press as soon as possible to avoid oxidation. 6.2.2 Key points of quality control: \x0d\ a Check whether the package/rebar exposure and drilling position are completely correct according to the circulation card and MI data. B the precise deviation of alignment shall not exceed the regulations of circulation card and MI data. \x0d\ C There should be no oxidation on the copper foil, no burr on the edge of encapsulation/reinforcement, and no impurity residue inside. D work tools should not be placed on the wrench, otherwise it may cause scratches or crush injuries. \x0d\ 6.3 Pressing: Pressing includes several steps such as traditional pressing, rapid pressing and oven curing; The purpose of hot pressing is to make the covering film or reinforcing plate completely attached to the wrench. By controlling the temperature, pressure, pressing time and stacking combination of auxiliary materials, good adhesion can be achieved, and defects such as flattening, air bubbles, wrinkling, glue overflow and broken wires can be minimized. In action. \x0d\ 6.3. 1 Auxiliary materials for rapid pressing of glass fiber and their functions. B Neverone: dust-proof and pressure-proof C iron plate: hot and gassy 6.3.2 Common bad phenomena \x0d\ a bubble: (1) Accessories such as silicone film are not available (2) steel plate is uneven (3) protective film is expired and b is crushed: (1) Accessories are not clean \x0d. C displacement of reinforcing plate: (1) instantaneous pressure is too large (2) steel bar is too thick (3) steel bar is not firmly attached. 6.3.3 Quality assurance \x0d\ a must be flat after pressing, without wrinkles, crushing, bubbles and curling. Line B shall not be broken due to the influence of pressing. \x0d\ c package. You can't peel it off with your hands. 7 Screen printing \x0d\ 7. 1 Basic principle: polyester or stainless steel mesh is used as the carrier, and the patterns of positive and negative films are transferred to the mesh by direct latex or indirect plate making to form a screen, which is used as a tool for face printing to print the required patterns and characters on the plate. \x0d\ 7.2 Classification of printing ink and its function-solder resist ink. Protection of circuit characters-silver paste such as marking lines-electromagnetic interference prevention 7.3 Quality confirmation \x0d\ 7.3. 1. The location and direction of printing must be consistent with the physical objects on the work instruction and inspection standard card. 7.3.2. There shall be no fixed break or pinhole. 7.3.3 .. After baking and curing, try to pull with 3M adhesive tape, and there should be no ink dropping. 8 Common defects in punching \x0d\ 8. 1: offset, rolling, reverse, burr, copper warping, scratches, etc .. 8.2 Key points of process control: correctness, directionality and dimensional accuracy of tools. 8.3 Key points of operation. 8.3. 1 There should be no scratches, wrinkles, etc. On the surface of the product. 8.3.2 The offset shall not exceed the specified range. 8.3.3 Correct use of molds with the same material number. \x0d\ 8.3.4 There shall be no serious burr, pulling, tearing or abnormal concave-convex points or residual glue and reinforcement deviation, and the release paper shall fall off. 8 Work according to the safety operation manual ... 8.4 Common defects and their causes: \x0d\ 8.4. 1. Offset printing A: Human reasons B: Other processes such as surface treatment, etching, drilling, etc. 8.4.2. Crushing A: blanking and molding B: compound die 8.4.3. Copper warping a:.