How does via repair the broken circuit board?

By this process, the hole cover oil is good and the wet film color is consistent. After hot air leveling, the via hole can't be tinned, and the solder balls won't be hidden in the hole, but it is easy to cause the ink in the hole to be welded after curing, resulting in poor solderability. After hot air leveling, bubbles and oil droplets appear at the edge of the via. This process is difficult to control the production, which requires the process engineer to adopt special process and parameters to ensure the quality of the plug hole.

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Related information:

1. The board is made of epoxy resin and glass fiber. After drilling, there is residual dust in the hole, which is not cleaned up. After curing, copper cannot be deposited, which will be tested in the flying needle test.

2. Stay in the tin furnace for too long during welding, which leads to the melting of hole copper, resulting in defects.

3. Protect the exposed part of the circuit board with high-temperature adhesive tape. Tape may be needed in the hole. If the epoxy resin reduces the inner diameter, it must be drilled again after the epoxy resin is cured. Please note that it may be necessary to preheat the circuit board before filling this area with epoxy resin. The preheated circuit board will make the epoxy resin easy to flow and stabilize. When the epoxy resin is cured, the epoxy resin coated on the unheated circuit board may precipitate below the surface of the circuit board. Please note that some components may be sensitive to high temperatures.