Slogan of semiconductor localization

On September 16-17, the Committee of Electric Vehicles 100 from China held the second global new energy vehicle supply chain innovation conference in Nanjing with the theme of "strengthening the three major automobile chains and realizing the automobile power". The relevant person in charge of BYD Semiconductor Co., Ltd. attended the conference and delivered a keynote speech.

At the theme forum of "Future Opportunities of Electrified Supply Chain" held on June 5438+07, BYD Semiconductor focused on sharing its innovative experience in the field of new energy vehicles. In the aspect of automobile electrification, the synchronous development of IGBT (insulated gate bipolar transistor) and SiC (silicon carbide) is realized with high efficiency as the core and improving the efficiency of power semiconductor as the focus. In the aspect of automobile intelligence, focusing on intelligence and integration, we will focus on improving the intelligence of MCU (Micro Control Unit) to meet the requirements of high control ability of vehicle regulations and develop multi-core MCU products.

As a leading semiconductor IDM enterprise in China, BYD Semiconductor is mainly engaged in the design, research and development, manufacturing and service of power semiconductors, intelligent control IC, intelligent sensors and photoelectric semiconductors. Its products are widely used in automobile, industry, energy, communication, consumer electronics and other fields, and continue to provide customers with leading automotive-grade semiconductor overall solutions, and strive to become an efficient, intelligent and integrated new semiconductor supplier.

With the global automobile industry entering a deep transition period, a new generation of automobiles represented by electrification and intelligence is changing the supply chain map of the original automobile manufacturing industry. Although there are some large suppliers of power batteries, motors and electronic controls in China, they still rely heavily on imported chips and electronic components. According to public data, China's power semiconductor market accounts for more than 40% of the global market, but its self-sufficiency rate is only 10%. China's automotive MCU market accounts for more than 30% of the global market, but basically 100% depends on imports.

In 2002, BYD began to enter the semiconductor field. In vehicle-mounted power semiconductors, BYD Semiconductor has accumulated technology for more than ten years, constantly updating and iterating. In 2005, BYD formed a team and began to develop IGBT；. . In 2009, the first IGBT chip independently developed by China went on the market, breaking the technological monopoly of foreign enterprises; In 20 18, IGBT 4.0 chip went on the market, which became a new benchmark for domestic high-end IGBT power chips. In 2020, the first batch of domestic loaded SiC MOSFET was listed, which has been applied to BYD's brand-new flagship luxury car "Han".

As the core of internal calculation and processing of automobile electronic system, single chip microcomputer is the key to realize automobile intelligence. In 2007, BYD entered the field of industrial MCU and adhered to the dual route of performance and reliability. Its working temperature is -40℃ ~ 125℃, its electrostatic capacity is more than 8KV, its cumulative shipment exceeds 2 billion pieces, and its failure rate is less than 10ppm.

Combined with the technology and manufacturing strength of industrial MCU for many years, BYD Semiconductor has achieved a difficult cross-level business extension from industrial MCU to vehicle standard MCU. 20 18 first-generation 8-bit car gauge MCU chip was successfully listed, and 20 19 first-generation 32-bit car gauge MCU chip was listed, with a cumulative loading of over 5 million vehicles, achieving zero breakthrough in localization. In the future, multi-core high-performance MCU chips with wider application range and leading technology will be launched.

BYD Semiconductor will continue to make use of the advantages of vehicle manufacturing, break the bottleneck of downstream application of domestic automotive grade semiconductors, achieve basic coverage of automotive grade semiconductor core system applications, and cooperate with industry peers to achieve win-win results, and work together to help the high-quality development of the new energy automobile industry.