What are LQFP encapsulation and FBGA encapsulation?

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QFP(Low profile Quad Flat Package) refers to QFP with a package thickness of 1.4mm, which is the name used by Japan Electronic Machinery Industry Association according to the new QFP shape specification.

The following is the introduction of QFP package:

The Chinese meaning of this technology is called plastic square flat packaging. The pin spacing of the CPU chip realized by this technology is very small and the pins are very thin. Generally, large-scale or very large-scale integrated circuits adopt this packaging form, and the number of pins is generally above 100. This technology is simple to operate and has high reliability when packaging CPU. Moreover, its package size is small, parasitic parameters are reduced, and it is suitable for high frequency applications; This technology is mainly suitable for SMT surface mount technology to install wiring on PCB.

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FBGA is a plastic package BGA.

The following are BGA packages:

In the 1990s, with the development of technology, the integration of chips has been continuously improved, the number of I/O pins has increased dramatically, and the power consumption has also increased, so the requirements for integrated circuit packaging have become more stringent. In order to meet the needs of development, BGA packaging has been applied to production. BGA is the abbreviation of English Ball Grid Array Package, namely ball grid array package.

The memory encapsulated by BGA technology can increase the storage capacity by 2 to 3 times without changing the volume. Compared with TSOP, BGA has smaller volume, better heat dissipation performance and electrical performance. BGA packaging technology greatly improves the storage capacity per square inch, and the memory products using BGA packaging technology are only one-third of TSOP packaging at the same capacity. In addition, compared with the traditional TSOP packaging method, BGA packaging method has a faster and more effective heat dissipation method.

BGA package memory

I/O terminals of BGA package are distributed under the package in the form of circular or columnar solder joints in the array. The advantage of BGA technology is that although the number of I/O pins has increased, the pin spacing has not decreased, thus improving the assembly yield. Although the power consumption is increased, BGA can be welded by controlled chipping method to improve its electrothermal performance. The thickness and weight are lower than those of the previous packaging technology; The parasitic parameters are reduced, the signal transmission delay is small, and the use frequency is greatly improved; * * * It can be assembled by surface welding with high reliability.

When it comes to BGA packaging, we can't help but mention Kingmax's patented TinyBGA technology. TinyBGA is called Tiny Ball Grid Array in English, which belongs to a branch of BGA packaging technology. Developed by Kingmax company in August 1998. The ratio of chip area to package area is not less than 1: 1. 14, and the storage capacity can be increased by 2-3 times under the condition of constant volume. Compared with TSOP packaging products, it has smaller volume and better heat dissipation and electrical performance.

TinyBGA package memory

The memory products with TinyBGA packaging technology are only 1/3 of TSOP packaging at the same capacity. The pins of TSOP package memory are led out from the periphery of the chip, and TinyBGA is led out from the center of the chip. This method effectively shortens the signal transmission distance, and the length of the signal transmission line is only 1/4 of that of the traditional TSOP technology, so the signal attenuation is also reduced. This not only greatly improves the anti-interference and anti-noise performance of the chip, but also improves the electrical performance. TinyBGA packaging chip can resist external frequency as high as 300MHz, while traditional TSOP packaging technology can only resist external frequency as high as 150MHz.

TinyBGA memory is thinner (the packaging height is less than 0.8mm), and the effective heat dissipation path from the metal substrate to the radiator is only 0.36 mm ... Therefore, TinyBGA memory has higher heat conduction efficiency, which is very suitable for long-term running systems and has excellent stability.